16 MHz core, 2 KB flash — sizing the MSP430F2011IPW for your BOM
The MSP430F2011IPW is a 16-bit microcontroller from the MSP430F2xx series, running the MSP430 CPU16 core at 16 MHz. On-chip memory is 2 KB of Flash (2K x 8 plus 256 bytes of information memory) and 128 bytes of RAM. The 2 KB Flash holds the application code and constant tables; the 128-byte RAM is the scratchpad for stack and small data structures. This is a part for a single-function sensor node or a simple control loop — not for a multi-threaded protocol stack.
Supply voltage, temperature grade, and the low-power trade-off
The MSP430 architecture draws under 1 µA in standby with the RAM retained; at 16 MHz active current is typically a few hundred microamps per MHz, so the actual system power budget is dominated by the wake time and the peripheral load, not the core itself. A sensor node deployed in an outdoor enclosure or an engine-bay module that sees 85°C on a summer day stays inside the operating envelope with no derating.
Peripherals for sensor and control tasks
On-chip peripherals include a brown-out detect and reset (BOR), power-on reset (POR), a PWM timer, and a watchdog timer. The slope A/D converter is a single-slope type — it uses an external RC time constant and the comparator to measure an analog voltage, which means no dedicated ADC pin and a lower bill-of-materials cost, but the conversion time and resolution (typically 10-bit) depend on the RC values and the clock frequency. For a temperature or battery-voltage read once per second, it is adequate; for a high-speed audio stream, it is not. Ten general-purpose I/O pins are available in the 14-TSSOP package. That count includes the pins shared with the slope A/D and the external oscillator — the actual usable I/O depends on whether you need those peripherals. In a minimal configuration (no crystal, no ADC), all ten are free for digital input/output.
Package, footprint, and board integration
The MSP430F2011IPW comes in a 14-pin TSSOP package with a 0.65 mm pitch and a 4.4 mm body width. The supplier device package is 14-TSSOP — the same footprint as the standard TSSOP-14. No exposed thermal pad; the die heat dissipates through the leads and the board copper. Mounting is surface-mount; the package ships in a tube.
Active production — sourcing the MSP430F2011IPW
For new designs, this part is a safe choice with a long expected supply horizon — the MSP430F2xx family is a mature, widely used platform. The base product number is MSP430F2011; the IPW suffix specifies the 14-TSSOP package in tube. Pin-compatible alternatives within the MSP430F2xx family exist (e.g., the MSP430F2012 with 4 KB Flash and 256 bytes RAM in the same package), but the evidence does not list a specific official cross-reference.