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Texas Instruments MSP430F1612IPM — Microcontrollers & Processors (MCU / MPU / DSP)

MSP430F1612IPM MCU 16-bit 8MHz 55KB Flash 64-LQFP

MPNMSP430F1612IPM
Active

Texas Instruments MSP430x1xx series MSP430F1612IPM, 16-bit MCU, 8MHz, 55KB Flash, 5K x 8 RAM, 48 I/O, 64-LQFP, -40°C to 85°C.

$26.6100Ref. price · indicative, final on quote
Packaging64-LQFP
RoHSROHS3 Compliant
SeriesMSP430x1xx
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430F1612IPM specifications
ParameterValue
SeriesMSP430x1xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed8MHz
PackageTray
RAM size5K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, SPI, UART/USART
Number of i (O)48
Core processorMSP430 CPU16
Case64-LQFP
Data convertersA/D 8x12b; D/A 2x12b
Program memory size55KB (55K x 8 + 256B)

Product details

8 MHz core, 55 KB flash, 5K RAM — memory headroom for mixed-signal control

The MSP430F1612IPM: The 8 MHz clock speed and 16-bit core deliver enough throughput for sensor fusion, data logging, and closed-loop control loops typical in industrial and instrumentation applications. The 55 KB flash (55K x 8 plus 256B) leaves room for a real-time operating system or a moderate application stack alongside the HAL. On-chip RAM of 5K x 8 provides working space for intermediate data buffers and stack variables without needing external memory. The flash is field-reprogrammable, supporting firmware updates over the product lifecycle.

Integrated data converters and peripheral set

The ADC resolution is adequate for 0.1% measurement accuracy at the system level, assuming a stable reference. Connectivity options are I²C, SPI, and UART/USART, covering the common serial buses for sensor and actuator communication. With 48 general-purpose I/O pins in a 64-LQFP package, there is enough headroom for parallel interfaces, keypad scanning, or driving indicator LEDs alongside the serial buses.

64-LQFP package and surface-mount integration

Housed in a 64-lead LQFP (10x10 mm body), the MSP430F1612IPM is a surface-mount device suited for automated assembly. The 0.5 mm pitch demands a controlled solder-paste stencil and reflow profile, but the package is standard enough for most PCB fab houses. The supplier device package is 64-LQFP (10x10).

Frequently asked questions

What is MSP430F1612IPM's listed speed and memory?

The 16-bit RISC CPU delivers enough throughput for sensor fusion and control loops in industrial applications.