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Texas Instruments MSP430F149IRTDT — Microcontrollers & Processors (MCU / MPU / DSP)

Texas Instruments MSP430F149IRTDT 16-bit MCU, 8 MHz

MPNMSP430F149IRTDT
Active

Texas Instruments MSP430x1xx series MSP430F149IRTDT, 16-bit MCU with MSP430 CPU16 core, 8 MHz speed, 60 KB Flash, 2K x 8 RAM, 48 I/O, SPI, UART, 8x12-bit ADC, 64-VQFN (9x9) package, -40°C to 85°C.

$16.6900Ref. price · indicative, final on quote
Packaging64-VFQFN Exposed Pad
RoHSROHS3 Compliant
SeriesMSP430x1xx
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430F149IRTDT specifications
ParameterValue
SeriesMSP430x1xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed8MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size2K x 8
Core size16-Bit
PeripheralsPOR, PWM, WDT
ConnectivitySPI, UART/USART
Number of i (O)48
Core processorMSP430 CPU16
Case64-VFQFN Exposed Pad
Data convertersA/D 8x12b
Program memory size60KB (60K x 8 + 256B)

Product details

16-bit MCU for low-power control — MSP430F149IRTDT

It runs at 8 MHz and integrates 60 KB of Flash program memory plus 2K x 8 of RAM, with 48 general-purpose I/O lines. On-chip peripherals include POR, PWM, and WDT, along with SPI and UART/USART serial interfaces and an 8-channel 12-bit ADC.

The 8 MHz clock rate is the ceiling for this MSP430 CPU16 core. At this speed the part draws its active-mode current, which is typically in the hundreds of microamps per MHz range for the MSP430 architecture. If your application needs to run a real-time control loop with tight timing at, say, 20 kHz PWM update, the 8 MHz clock still leaves hundreds of cycles per update — but if you are doing heavy DSP or floating-point math, this is not the right core. The trade-off is that the low clock keeps power low, which is the whole point of the MSP430 family.

60 KB Flash and 2K x 8 RAM — sizing the firmware

The 60 KB Flash (organized as 60K x 8 plus 256 bytes) is a mid-range density for the MSP430x1xx series. It can hold a modest control firmware stack with a bootloader, a communication protocol handler (e.g., Modbus RTU over UART), and a sensor calibration table. The 2K x 8 RAM is tight — 2 KB — so any data buffering, such as a UART receive ring buffer or ADC sample FIFO, needs careful sizing. If your application requires large lookup tables or extensive data logging in RAM, you will either need to use the Flash for constant data or step up to a higher-RAM variant in the family.

The exposed pad is also the ground connection for the die, so it is not optional. Surface-mount assembly is standard; the package is MSL-rated per the TI datasheet (typically MSL 3, but verify the specific date code's moisture sensitivity level on the reel label).

The part is ROHS3 compliant.

Frequently asked questions

What is the difference between MSP430F149IRTDT and MSP430F149IPM?

The difference is the package. MSP430F149IRTDT is supplied in a 64-VFQFN exposed-pad package (Tape & Reel or Cut Tape), while MSP430F149IPM is a 64-LQFP package. The VFQFN is smaller (9x9 mm vs LQFP's larger footprint) and has an exposed thermal pad. The core, memory, peripherals, and temperature range are identical between the two order codes.

Is MSP430F149IRTDT RoHS compliant?

Yes, the MSP430F149IRTDT is ROHS3 compliant per the manufacturer's listing.