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Texas Instruments MSP430F1222IRHBR — Microcontrollers & Processors (MCU / MPU / DSP)

TI MSP430F1222IRHBR 16-bit MCU, 8MHz, 4KB Flash, 32-VQFN

MPNMSP430F1222IRHBR
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Texas Instruments MSP430x1xx series, 16-bit MSP430 CPU16 microcontroller, MSP430F1222IRHBR, 8MHz core, 4KB Flash, 256B RAM, 22 I/O, 8x10b ADC, SPI/UART, 1.8-3.6V, 32-VFQFN (5x5), -40 to 85°C, Tape & Reel.

$3.2750Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430F1222IRHBR specifications
ParameterValue
SeriesMSP430x1xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed8MHz
PackageTape & Reel (TR)
RAM size256 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivitySPI, UART/USART
Number of i (O)22
Core processorMSP430 CPU16
Case32-VFQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size4KB (4K x 8 + 256B)

Product details

Memory and peripheral budget — what fits in 4 KB Flash and 256 B RAM

The MSP430F1222IRHBR packs 4 KB of program Flash and 256 bytes of RAM. For a battery-powered sensor node running a polling loop with a 10-bit ADC reading and a UART output, the firmware footprint typically lands under 2 KB, leaving room for a small scheduler or state machine. The 256 B RAM, however, limits buffered data to a few hundred samples — a data logger streaming at 1 kHz would overflow in under a second without external SRAM. The 8-channel 10-bit ADC reads analog signals at 0.1% resolution — adequate for temperature, pressure, or current-sense inputs where 10 mV per LSB at a 2.5 V reference is acceptable. Higher-resolution applications (e.g., load-cell bridges) would need an external 16-bit ADC or a move to the MSP430F2xxx family with a 12-bit ADC.

Supply and temperature — runs on a coin cell, lives on the factory floor

The brown-out detect resets the core when the supply dips below the threshold, preventing corrupt Flash writes during battery drop-out. No derating is needed for ambient operation up to 85°C, though the 8 MHz core speed may require a wait-state at the high end if the Flash access time exceeds the cycle budget.

Package and board integration — 32-VFQFN with exposed pad

The 0.5 mm pitch QFN demands a solder-paste stencil with 0.25 mm apertures and a reflow profile that avoids tombstoning on the corner pins. All 22 I/O pins are brought out to the package periphery — no hidden balls. The SPI and UART/USART pins share the same port pins as general-purpose I/O, so a board spin that reassigns the serial interface to a different pin pair requires a firmware change but no PCB re-layout.

Active lifecycle — no end-of-life risk for new designs

The part is suitable for both new product introductions and production replenishment. The base product number MSP430F1222 shares the same die and peripheral set across the QFN and TSSOP package variants, so a package migration (e.g., to the 28-TSSOP) is possible without firmware changes if board space allows.

Frequently asked questions

What is the closest pin-compatible alternative to MSP430F1222IRHBR in this MSP430x1xx family?

The MSP430F1222IRHBR is the 4 KB Flash variant in the 32-VFQFN package. The MSP430F1232 (8 KB Flash, same pinout) and MSP430F1122 (4 KB Flash, 20-pin TSSOP) are in the same MSP430x1xx family but differ in memory or package. No direct pin-compatible drop-in with identical memory and package is listed as an official second-source; confirm the BOM position before substituting.

What compliance documentation does Texas Instruments provide for MSP430F1222IRHBR?

Texas Instruments provides RoHS and REACH compliance declarations for this part. The 32-VFQFN package is lead-free and compatible with standard reflow profiles. No UL or IEC certification is listed for this MCU; those standards typically apply to end-equipment rather than the IC itself.