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Texas Instruments MSP430F1121AIDGV — Microcontrollers & Processors (MCU / MPU / DSP)

TI MSP430F1121AIDGV 16-bit MCU, 8 MHz, 4 KB Flash, 20-TVSOP

MPNMSP430F1121AIDGV
Active

Texas Instruments MSP430x1xx 16-bit MCU, MSP430F1121AIDGV, 8 MHz, 4 KB Flash, 256 B RAM, 14 I/O, 20-TVSOP, -40°C to 85°C.

$6.3200Ref. price · indicative, final on quote
Packaging20-TFSOP (0.173", 4.40mm Width)
RoHSROHS3 Compliant
SeriesMSP430x1xx
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430F1121AIDGV specifications
ParameterValue
SeriesMSP430x1xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed8MHz
PackageTube
RAM size256 x 8
Core size16-Bit
PeripheralsPOR, WDT
Number of i (O)14
Core processorMSP430 CPU16
Case20-TFSOP (0.173\", 4.40mm Width)
Data convertersSlope A/D
Program memory size4KB (4K x 8 + 256B)

Product details

What the 8 MHz ceiling and 4 KB flash mean for a sensor node

The MSP430F1121AIDGV runs the 16-bit MSP430 CPU16 core at 8 MHz, which is the clock ceiling for this part — not a turbo mode, but the max the internal oscillator and flash read path are rated for. With 4 KB of program flash and 256 bytes of RAM, the memory budget is tight: a typical sensor polling loop with a PID or simple state machine fits, but you are not running a RTOS or a USB stack here. The 14 I/O pins handle a few digital sensors, a small keypad, or a serial interface to a host controller. The Slope A/D converter is a low-cost integrated ADC that uses an external RC time constant — it is not a SAR or sigma-delta, so expect moderate resolution and sample rate, but it saves a separate ADC chip in cost-sensitive designs.

Package and board-fit: 20-TVSOP rework reality

The exposed pad is small — no thermal paddle to worry about for reflow, but the narrow leads mean a bridged pair is easy to miss under a microscope. Pin 1 is marked by a chamfer on the package corner; the orientation is unambiguous once you see the chamfer. The package is thin enough that the die heats quickly — do not dwell or the internal bond wires can lift. Clean the pads with braid and a tacky flux before placing the new part.

The part is rated for the full temperature range, not just commercial — so a motor drive cabinet or a rooftop sensor box is within spec. Lifecycle status is Active per Texas Instruments, with ROHS3 compliance.

Frequently asked questions

What is the closest functional second-source to MSP430F1121AIDGV?

The MSP430FR5729IDA is a functional alternative from the same TI MSP430 family, but it is not a pin-compatible drop-in. The FR5729 uses a newer MSP430 CPUXV2 core with FRAM instead of flash, runs at 8 MHz, has 30 I/O, and comes in a different package (48-pin). A board redesign and firmware port are required to switch.

What compliance documentation does TI provide for MSP430F1121AIDGV?

The part is ROHS3 compliant per the lifecycle record. Standard Texas Instruments documentation includes the datasheet, application notes for the MSP430x1xx family, and a PCN notification service for any future changes.