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Texas Instruments LP8557IAYFQT — Discrete Semiconductors

Texas Instruments LP8557IAYFQT 6-Ch Boost LED Driver, 28V

MPNLP8557IAYFQT
End of Life

Texas Instruments LP8557IAYFQT, DC DC Regulator LED Driver, 6 outputs, 28V, 25mA/ch, PWM dimming, Step-Up (Boost) topology, 16-DSBGA.

$2.77Ref. price · indicative, final on quote
Packaging16-WFBGA, DSBGA
RoHSROHS3 Compliant
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

LP8557IAYFQT specifications
ParameterValue
TypeDC DC Regulator
MountingSurface Mount
Voltage - output28V
Voltage5.5V
Current - output (Channel)25mA
Frequency500kHz, 1MHz
I/O channels6
Operating temperature-30°C ~ 85°C (TA)
DimmingPWM
PackageTape & Reel (TR); Cut Tape (CT)
TopologyStep-Up (Boost)
ApplicationsBacklight
Case16-WFBGA, DSBGA
Internal switchYes

Product details

Active production — what it means for the BOM line

The LP8557IAYFQT: ROHS3 compliance is confirmed on the manufacturer's record, so the part clears the material declaration gate without a waiver.

Boost regulator parametrics for backlight arrays

This is a 6-channel DC-DC boost regulator with integrated switches — the internal FET handles the step-up conversion, so no external power transistor is needed on the output stage. Each channel delivers 25 mA continuous, and the total output voltage can go up to 28 V — that combination drives a series string of six to eight white LEDs per channel in a typical backlight panel. PWM dimming is supported directly, which keeps the colour temperature stable across the brightness range — the controller modulates the on-time of the boost switch rather than dropping the current below the LED's rated minimum.

Switching frequency and supply rail fit

The oscillator can be set to either 500 kHz or 1 MHz via an external resistor — 1 MHz shrinks the inductor and output capacitor values for a compact layout, while 500 kHz trades component size for lower switching losses. The operating temperature range is -30°C to 85°C ambient — this covers most indoor and automotive cabin applications but does not reach the full -40°C industrial floor; check the thermal profile against your enclosure's ambient low.

Footprint and board integration

Packaged in a 16-bump DSBGA (0.4 mm pitch wafer-level chip-scale), the LP8557IAYFQT occupies roughly 2.5 mm × 2.0 mm of board area — the small footprint is the trade-off for a stencil-printed solder-paste process and X-ray inspection at assembly.

Frequently asked questions

What compliance documentation does TI provide for LP8557IAYFQT?

Texas Instruments confirms ROHS3 compliance for the LP8557IAYFQT on its official product record — the standard TI compliance package includes the RoHS certificate of compliance, REACH SVHC declaration, and material declaration data sheet.