LP8552TLE-E04/NOPB

End of Life In Stock · 24-48h Dispatch

Texas Instruments · Discrete Semiconductors

Texas Instruments LP8552TLE-E04/NOPB DC DC Regulator, Step-Up (Boost) topology, 6 outputs, 450 mA per channel, 40 V output, PWM dimming, 25-WFBGA DSBGA, Tape & Reel.

Texas Instruments LP8552TLE-E04/NOPB — Discrete Semiconductors
RoHS Compliant · Lead-Free EIA-481 Standard Tape & Reel

Key Specifications

All 13 Specs
Package / Case
25-DSBGA
Mounting Type
Surface Mount
Operating Temp
-40°C ~ 85°C (TA)
Packaging Format
Tape & Reel (TR); Cut Tape (CT)
Supply Voltage
2.7V
Output / Current
450mA
Type
DC DC Regulator
Voltage - output
40V
In Stock: 485 pcs
MOQ: 1
Logistics: Shenzhen / HK Dispatch · DHL / FedEx DAP (3-7d) · Russia & CIS DDP
SWIFT T/T
$3.12 / pc (USD)
● Direct Purchase Ready
Volume Pricing Breaks per unit (USD)
1+ pcs
$3.12
10+ pcs
$2.81
30+ pcs
$2.56
100+ pcs
$2.31
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Full Technical Specifications

13 Parameters
LP8552TLE-E04/NOPB specifications
Parameter / AttributeSpecification / Value
TypeDC DC Regulator
MountingSurface Mount
Voltage - output40V
Supply voltage2.7V
Current - output (Channel)450mA
I/O channels6
Operating temperature-40°C ~ 85°C (TA)
DimmingPWM
PackageTape & Reel (TR); Cut Tape (CT)
TopologyStep-Up (Boost)
ApplicationsBacklight
Case25-WFBGA, DSBGA
Internal switchYes
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Technical Details & Description

PWM dimming and output topology

The LP8552TLE-E04/NOPB: Dimming is handled via PWM, the standard interface for LED backlight controllers — the PWM duty cycle sets the average current through each string while the boost stage maintains a constant voltage headroom. Six independent current sinks allow per-string current matching, critical for uniform panel brightness across the full dimming range. The 450 mA per-channel rating supports parallel LED configurations where each string draws up to that current; total output power is limited by the boost converter's input power budget and thermal dissipation in the 25-DSBGA package.

Package and board integration — 25-DSBGA

The 25-bump DSBGA is a wafer-level chip-scale package with a 0.4 mm pitch typical for this bump count. The small footprint — roughly 2.2 mm × 2.2 mm — saves board area but demands a controlled reflow profile and X-ray inspection after assembly to confirm solder-joint integrity under each bump.

Compliance and documentation

Texas Instruments lists the LP8552TLE-E04/NOPB as ROHS3 compliant, meeting the EU RoHS exemption framework without conflict.

Frequently asked questions

What is the closest functional second-source for LP8552TLE-E04/NOPB — TLC5940RHBR?

The TLC5940RHBR is a linear LED driver with a shift-register interface, not a boost regulator. It lacks the integrated switching FET and step-up topology of the LP8552TLE-E04/NOPB. The two parts are not drop-in replacements; a board redesign would be required to substitute one for the other.

What compliance documentation does Texas Instruments provide for LP8552TLE-E04/NOPB?

Texas Instruments certifies the LP8552TLE-E04/NOPB as ROHS3 compliant. The manufacturer typically provides a Certificate of Compliance (CoC) and material declaration upon request through distribution channels.

LP8552TLE-E04/NOPB
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