Quad op amp with AEC-Q100 grade — what it brings to the board
Package and rework — 14-TSSOP under the hot air
The 14-TSSOP package (0.173" body width, 4.40 mm) is a fine-pitch SOIC derivative. The thermal mass is low, so a standard hot-air profile at 300°C for 10–15 seconds lifts it clean without cooking the adjacent passives. MSL level is typical for this package class.
