Skip to main content
Texas Instruments LMV331M5X — Analog & Data Acquisition

Texas Instruments LMV331M5X Comparator, SOT-23-5, 2.7-5.5V

MPNLMV331M5X
End of Life

Texas Instruments LMV331M5X general purpose comparator, SC-74A SOT-753 package, SOT-23-5, 2.7V-5.5V supply, 600ns propagation delay, 120µA quiescent current.

$0.67Ref. price · indicative, final on quote
PackagingSC-74A, SOT-753
RoHSRoHS non-compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

LMV331M5X specifications
ParameterValue
TypeGeneral Purpose
Output typeCMOS, Open-Collector, TTL
MountingSurface Mount
Voltage - input offset7mV @ 5V
Voltage - supply, single (Dual (±))2.7V ~ 5.5V
Output current84mA @ 5V
Current - quiescent120µA
Current - input bias0.25µA @ 5V
Operating temperature-40°C ~ 85°C
PackageBulk
CaseSC-74A, SOT-753
Number of elements1
Propagation delay600ns

Product details

SOT-23-5 comparator with flexible output drive

The Texas Instruments LMV331M5X is a general-purpose comparator in a SOT-23-5 package (SC-74A / SOT-753 footprint). The output stage accepts CMOS, open-collector, or TTL loads — the 84 mA typical output current at 5 V drives a logic input, an LED indicator, or a small relay coil directly. The 600 ns max propagation delay keeps it fast enough for most sensor threshold and overvoltage detection loops.

Low quiescent draw for battery and portable gear

Input offset voltage is 7 mV max — adequate for general-purpose window comparators and zero-crossing detectors where sub-mV precision is not required.

Sourcing and board-fit notes

The SOT-23-5 package is a standard 5-pin footprint with 0.95 mm pitch — hand-reworkable with a fine-tip iron or hot air.

Frequently asked questions

What compliance documentation does Texas Instruments provide for the LMV331M5X?

The LMV331M5X is RoHS non-compliant (lead-bearing finish). No UL, IEC, or REACH documentation is listed in the available records. The datasheet from Texas Instruments covers electrical specifications and package dimensions.