LMC6061AIMX/NOPB

Texas Instruments

Texas Instruments LMC6061AIMX/NOPB general-purpose op-amp, single circuit, 100 kHz gain-bandwidth, 0.035 V/µs slew rate, rail-to-rail output, 8-SOIC surface-mount package, Tape & Reel or Cut Tape.

Texas Instruments LMC6061AIMX/NOPB
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[IN STOCK] In Stock: 135 pcs
$2.27/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

LMC6061AIMX/NOPB specifications
Parameter / AttributeSpecification / Value
Output typeRail-to-Rail
MountingSurface Mount
Amplifier typeGeneral Purpose
Voltage - input offset100 µV
Voltage - supply span15.5 V
Current - supply24µA
Current - input bias0.01 pA
Operating temperature-40°C ~ 85°C
Gain bandwidth product100 kHz
PackageTape & Reel (TR); Cut Tape (CT)
Slew rate0.035V/µs
Case8-SOIC (0.154\", 3.90mm Width)
Number of circuits1

Technical details

Active production, low-power precision for battery and sensor front-ends

The LMC6061AIMX/NOPB: Its 0.035 V/µs slew rate and 100 kHz gain-bandwidth product tell you this is a precision low-frequency amplifier, not a high-speed buffer — the output can swing 3.5 V in 100 µs, which sets the ceiling for AC signal conditioning in the sub-20 kHz band.

Input bias and offset — what they mean for a photodiode or thermocouple front-end

Input bias current is 0.01 pA typical — that is 10 fA, low enough that a photodiode amplifier with a 10 MΩ feedback resistor sees only 0.1 µV of voltage error from bias current, negligible compared to the 100 µV input offset voltage. The 100 µV input offset defines the DC accuracy floor — for a thermocouple amplifying a 40 µV/°C signal, a 100 µV offset corresponds to a 2.5 °C error at the ADC before any calibration trim.

Supply flexibility and rail-to-rail output

Supply span from 4.5 V to 15.5 V means it works on a single 5 V rail (common in industrial 24 V-to-5 V systems) or on dual ±5 V supplies — the rail-to-rail output lets the signal swing to within millivolts of each rail, recovering the full dynamic range that a traditional bipolar output would lose. The 8-SOIC package (3.90 mm width, 0.154" body) is a standard footprint for two-layer boards — no fine-pitch fan-out required, and the 1.27 mm pin pitch is hand-solderable for prototype rework.

Temperature grade and compliance

ROHS3 compliant (no exemptions) — ships globally without restriction under EU RoHS directives; no date-code sorting needed for restricted-substance compliance.

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