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Texas Instruments LM74700MDDFREP — Power Management (PMIC / Gate Driver)

LM74700MDDFREP N+1 ORing Controller – TI, SOT-23-8, Active

MPNLM74700MDDFREP
Active

Texas Instruments LM74700MDDFREP, N+1 ORing Controller, N-Channel FET, 3.2V to 65V supply, 80 µA supply current, SOT-23-8 package, -50°C to 125°C operating range.

$5.7500Ref. price · indicative, final on quote
PackagingSOT-23-8
RoHSNot applicable
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

LM74700MDDFREP specifications
ParameterValue
TypeN+1 ORing Controller
FET typeN-Channel
MountingSurface Mount
Supply voltage3.2V ~ 65V
Current - supply80 µA
Operating temperature-50°C ~ 125°C (TJ)
PackageTape & Reel (TR) Cut Tape (CT)
ApplicationsGeneral Purpose
CaseSOT-23-8
Delay time - ON1.4 µs
Delay time - OFF450 ns
Internal switchNo
Ratio - Input:Output1:1

Product details

What this ORing controller does for your power rail

The LM74700MDDFREP is an N+1 ORing controller from Texas Instruments, designed to replace a Schottky diode with a low-Rds(on) N-channel MOSFET in redundant power-supply architectures. It handles a supply range of 3.2V to 65V, covering 12V, 24V, and 48V rails without external pre-regulation. The controller draws 80 µA typical supply current, which keeps standby loss low in always-on ORing applications such as base-station power feeds or industrial PLC backplanes.

Switching speed and fault response

The ON delay is 1.4 µs and the OFF delay is 450 ns. The fast turn-off limits reverse current during a supply fault or short, reducing stress on the upstream MOSFET and downstream load. Because the controller does not integrate the power switch, the designer selects the external N-channel FET based on the load current and thermal budget. The 1:1 input-to-output ratio simplifies the control loop for single-channel ORing.

The device is supplied in an SOT-23-8 package with a TSOT-23-8 supplier device package. The small body fits tight layouts, but the thermal pad is absent — the junction-to-ambient thermal resistance relies on the copper area on the PCB around the pins. Surface-mount assembly is standard; the tape-and-reel option supports automated pick-and-place for volume production.

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