LM49450SQ/NOPB

Texas Instruments · Boomer® Series

Texas Instruments Boomer® Class D audio amplifier, LM49450SQ/NOPB, 2-channel stereo with headphone output, 2.5W x 2 @ 4Ω, I²C/I²S control, 32-WQFN exposed pad, -40°C to +85°C.

Texas Instruments LM49450SQ/NOPB
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[IN STOCK] In Stock: 68 pcs
$9.29/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

LM49450SQ/NOPB specifications
Parameter / AttributeSpecification / Value
TypeClass D
SeriesBoomer®
Output type2-Channel (Stereo) with Stereo Headphones
MountingSurface Mount
Supply voltage2.7V ~ 5.5V
Max output power x channels @ load2.5W x 2 @ 4Ohm
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
Features3D, DAC, Depop, I²C, I²S, Mute, Short-Circuit and Thermal Protection, Shutdown, Volume Control
Case32-WFQFN Exposed Pad

Technical details

Class D efficiency and output-stage architecture

The LM49450SQ/NOPB is a Class D stereo amplifier from the Boomer® family, delivering 2.5W per channel into a 4Ω load from a 2.7V–5.5V supply. Class D switching topology keeps quiescent losses low — important for battery-powered speakers where every milliwatt of idle current cuts into playtime. The output stage is configured as 2-channel (stereo) with a separate stereo headphone path, so a single IC drives both the main speakers and a headphone jack without an external mux.

Digital audio interface and system control

Digital audio enters via an I²S bus — the standard serial interface for codecs, DSPs, and Bluetooth audio modules. Volume, mute, 3D enhancement, and depop are set through an I²C control port, which also reports fault status from the short-circuit and thermal protection circuits. The depop feature suppresses the turn-on/turn-off thump that otherwise couples through the speaker. For a portable dock or smart speaker, this avoids the audible pop that users hear on power-up.

Thermal and layout for the 32-WQFN exposed pad

Housed in a 32-lead WFQFN with exposed pad (5×5 mm), the LM49450SQ/NOPB requires a thermal land on the PCB to sink heat from the Class D output stage. Surface-mount assembly follows standard QFN reflow profiles (MSL level not stated, but the exposed pad demands a solder paste stencil opening matching the datasheet land pattern). Tape & Reel or Cut Tape packaging is available for prototyping or production volume.

LM49450SQ/NOPB
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