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Texas Instruments LM4666SD/NOPB — Analog & Data Acquisition

LM4666SD/NOPB TI Boomer Class D Amp, 1.2W x 2 @ 8Ω

MPNLM4666SD/NOPB
End of Life

Texas Instruments Boomer® Class D audio amplifier, LM4666SD/NOPB, 2-channel stereo, 1.2W x 2 @ 8Ω, filterless, 2.8V–5.5V supply, -40°C to 85°C, 14-WSON (4x3) package.

$0.79Ref. price · indicative, final on quote
Texas Instruments LM4666SD/NOPB datasheet (PDF)
Packaging14-WFDFN Exposed Pad
SeriesBoomer®
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

LM4666SD/NOPB specifications
ParameterValue
TypeClass D
SeriesBoomer®
Output type2-Channel (Stereo)
MountingSurface Mount
Supply voltage2.8V ~ 5.5V
Max output power x channels @ load1.2W x 2 @ 8Ohm
Operating temperature-40°C ~ 85°C (TA)
PackageBulk
FeaturesDepop, Differential Inputs, Short-Circuit Protection, Shutdown
Case14-WFDFN Exposed Pad

Product details

Industrial temperature grade — not just consumer

The exposed pad pulls heat into the PCB copper.

Active lifecycle — no LTB risk on this line

Texas Instruments lists the LM4666SD/NOPB as Active (current production). There is no last-time-buy notice, no NRND flag, and no announced end-of-life. For a BOM freeze or a production ramp, this part is a stable line item. The Boomer® family has broad distribution coverage, so multi-source procurement through independent channels is straightforward — we source and quote against an RFQ with current availability confirmed at quote time.

Frequently asked questions

What is the maximum output power per channel of LM4666SD/NOPB?

1.2W per channel into an 8Ω load, stereo. That is the rated output at the listed supply voltage range.

Is LM4666SD/NOPB a filterless class D amplifier?

Yes. The filterless modulation eliminates the output LC filter, saving two inductors and two capacitors per channel compared to conventional Class D designs.

What package does LM4666SD/NOPB come in?

A 14-lead WFDFN with exposed pad (14-WSON, 4x3 mm body). The exposed pad must be soldered to a PCB ground plane for thermal management.