80 MHz Cortex-M3 with Ethernet and USB OTG — what this part was designed for
It was positioned for industrial and networked embedded applications that require both real-time control and connectivity — the peripheral set includes Ethernet MAC+PHY, USB OTG, CAN, multiple UART/SPI/I²C interfaces, and a 16-channel 12-bit ADC.
Memory and peripheral fit for a gateway or HMI controller
With 384 KB of Flash and 96 KB of SRAM, this MCU can host a lightweight TCP/IP stack alongside a real-time control loop. The 65 GPIOs, combined with PWM, QEI, and I²S, also support motor-drive feedback and audio processing in the same chip.
The Stellaris line was acquired by TI and later phased out in favor of the Tiva-C and SimpleLink families, but no direct pin-compatible drop-in replacement was published for this specific BGA variant.
108-ball BGA — layout and rework notes
The 108-LFBGA package measures 10x10 mm with a 0.8 mm ball pitch typical of this density tier. Surface-mount assembly requires a solder paste stencil matched to the BGA land pattern; X-ray inspection is recommended after reflow to check for head-in-pillow or voiding. For rework, a preheat profile that keeps the entire board above 100°C before local hot-air reflow reduces the risk of cold joints on the inner balls. The supplier device package code is 108-BGA (10x10).