TI LM3S9L97-IBZ80-C1T ARM Cortex-M3 MCU 80MHz 108-LFBGA
MPNLM3S9L97-IBZ80-C1T
Obsolete
Texas Instruments LM3S9L97-IBZ80-C1T, Stellaris ARM Cortex-M3S 9000 series, 32-bit single-core MCU running at 80MHz with 128KB Flash and 48KB RAM, integrated Ethernet MAC, USB OTG, CANbus and full serial peripheral set, packaged in 108-LFBGA (10x10) on tape and reel, rated -40°C to 85°C.
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026
Specifications
| Parameter | Value |
|---|---|
| Series | Stellaris® ARM® Cortex®-M3S 9000 |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.235V ~ 1.365V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 80MHz |
| Package | Tape & Reel (TR) |
| RAM size | 48K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
| Connectivity | CANbus, Ethernet, I²C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG |
| Number of i (O) | 60 |
| Core processor | ARM® Cortex®-M3 |
| Case | 108-LFBGA |
| Data converters | A/D 16x10b |
| Program memory size | 128KB (128K x 8) |
Frequently asked questions
Can the 108-LFBGA package be reliably reworked in the field?
No. The 0.5mm ball pitch of the 108-LFBGA requires hot-air reflow tooling and BGA temperature profiling. Standard rework equipment will not produce a reliable joint. Board-level exchange is the practical field-service path, not component-level rework.