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Texas Instruments LM3S9DN5-IBZ80-A1 — Microcontrollers & Processors (MCU / MPU / DSP)

TI LM3S9DN5-IBZ80-A1 ARM Cortex-M3 MCU, 80MHz, 512KB Flash

MPNLM3S9DN5-IBZ80-A1
Obsolete

Texas Instruments Stellaris ARM Cortex-M3S 9000 series LM3S9DN5-IBZ80-A1, 32-bit ARM Cortex-M3 MCU, 80MHz, 512KB Flash, 96KB RAM, Ethernet/USB OTG/CAN, 108-LFBGA (10x10 mm), -40 to 85°C, 1.235-1.365V.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LM3S9DN5-IBZ80-A1 specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 9000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.235V ~ 1.365V
Operating temperature-40°C~85°C(TA)
Speed80MHz
PackageTray
RAM size96K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG
Number of i (O)72
Core processorARM® Cortex®-M3
Case108-LFBGA
Data convertersA/D 16x12b
Program memory size512KB (512K x 8)

Product details

ARM Cortex-M3 at 80 MHz with Ethernet and USB OTG

The LM3S9DN5-IBZ80-A1: On-chip data conversion comes from a 16-channel 12-bit ADC. This part is packaged in a 108-ball LFBGA (10x10 mm) with 72 general-purpose I/O lines.

80 MHz core — timing budget for networked control

The 80 MHz Cortex-M3 core, combined with the DMA controller and the peripheral set, handles protocol stacks for Ethernet, USB, and CAN without a separate network coprocessor. The 512 KB Flash is large enough for a TCP/IP stack plus application code; the 96 KB RAM supports multiple packet buffers. The internal oscillator keeps BOM count low, though an external crystal improves clock accuracy for Ethernet timing.

Obsolete — last-time-buy and surplus sourcing

The lifecycle status is Obsolete. TI has ended production of this Stellaris-series device. For existing BOM lines, procurement must go through independent distribution or the surplus market.

108-ball BGA — layout considerations

The 108-LFBGA package measures 10x10 mm with a 0.8 mm ball pitch typical for this class. The fine-pitch BGA requires a multi-layer PCB with microvia capability for fanout. Decoupling should follow the supply pin map — the core runs from a 1.235 V to 1.365 V rail, separate from the 3.3 V I/O supply.

Frequently asked questions

Is LM3S9DN5-IBZ80-A1 obsolete?

Yes, the lifecycle status is Obsolete. TI has discontinued production. No official replacement order code is listed. For existing designs, source through surplus or broker channels against an RFQ.

Can I use LM3S9DN5-IBZ80-A1 in new designs?

Not recommended. With an Obsolete lifecycle status and no listed successor, new designs should select a current-production ARM Cortex-M3 or Cortex-M4 MCU with equivalent Ethernet, USB OTG, and CAN peripherals.

What is the replacement for LM3S9DN5-IBZ80-A1?

For a pin-compatible alternative within the Stellaris family, a parametric search across TI's current Cortex-M3 portfolio with Ethernet, USB OTG, and CAN in a 108-BGA package is needed. Contact us with your requirements for cross-reference assistance.