LM3S9D92-IBZ80-A1T — Stellaris ARM Cortex-M3 80MHz MCU, 512KB Flash, 108-LFBGA
MPNLM3S9D92-IBZ80-A1T
Obsolete
Texas Instruments Stellaris LM3S9D92-IBZ80-A1T, ARM Cortex-M3 80MHz single-core, 512KB flash 96KB RAM, Ethernet USB OTG CANbus, 65 I/O, 108-LFBGA, 1.235V–1.365V core, -40°C–85°C, Tape & Reel, Obsolete.
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026
Specifications
| Parameter | Value |
|---|---|
| Series | Stellaris® ARM® Cortex®-M3S 9000 |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.235V ~ 1.365V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 80MHz |
| Package | Tape & Reel (TR) |
| RAM size | 96K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG |
| Number of i (O) | 65 |
| Core processor | ARM® Cortex®-M3 |
| Case | 108-LFBGA |
| Data converters | A/D 16x12b |
| Program memory size | 512KB (512K x 8) |
Frequently asked questions
What is the rework reality for the 108-LFBGA package?
The 108-LFBGA at 0.8mm ball pitch requires hot-gas reflow rework with a profiled stencil. Yield on boards that have already been through thermal cycling drops. Board-level repair shops offering BGA reballing exist but do not typically hold stock tooling for this specific part — service availability is quote-dependent and not guaranteed for production volumes.