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Texas Instruments LM3S9C97-IBZ80-A1 — Microcontrollers & Processors (MCU / MPU / DSP)

Texas Instruments LM3S9C97-IBZ80-A1 Stellaris ARM Cortex-M3 MCU, 80 MHz

MPNLM3S9C97-IBZ80-A1
Obsolete

Texas Instruments Stellaris ARM Cortex-M3S 9000 series LM3S9C97-IBZ80-A1, 32-bit MCU, 80 MHz, 512 KB Flash, 64 KB RAM, Ethernet + USB OTG + CAN, 108-BGA, -40 to 85 °C.

Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LM3S9C97-IBZ80-A1 specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 9000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.235V ~ 1.365V
Operating temperature-40°C~85°C(TA)
Speed80MHz
PackageTray
RAM size64K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
ConnectivityCANbus, Ethernet, I²C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG
Number of i (O)60
Core processorARM® Cortex®-M3
Case108-LFBGA
Data convertersA/D 16x12b
Program memory size512KB (512K x 8)

Product details

EOL status — what it means for a BOM line

80 MHz Cortex-M3 — the processing baseline for a successor

The 80 MHz core speed is the primary performance anchor. Any replacement candidate must match or exceed this clock rate to maintain timing closure on existing firmware and communications stacks. The Cortex-M3 architecture at this speed handles protocol stacks for Ethernet, USB, and CAN simultaneously with moderate headroom — a slower part will stall on the network buffers.

Memory map: 512 KB Flash, 64 KB RAM

512 KB of Flash and 64 KB of RAM define the firmware and data space. A replacement needs at least this memory footprint unless the application code is recompiled for a different memory map. The 64K x 8 RAM organization is byte-addressable, standard for Cortex-M3.

The LM3S9C97 integrates Ethernet (MAC+PHY), USB OTG, CAN, and multiple serial buses (I²C, SPI, SSI, UART, IrDA, Microwire, LIN). It also includes a quadrature encoder interface (QEI), PWM, DMA, and a 16-channel 12-bit ADC.

The 108-ball BGA (10x10 mm body) is a surface-mount package that requires reflow soldering and X-ray inspection for void detection.

Frequently asked questions

What is the replacement or equivalent for LM3S9C97-IBZ80-A1?

There is no official Texas Instruments replacement listed for this exact order code. A pin-compatible successor within the Stellaris family has not been designated. For a functional replacement, look for another Cortex-M3 MCU with Ethernet MAC+PHY, USB OTG, CAN, 512 KB Flash, 64 KB RAM, and an 80 MHz core in a 108-BGA package — but verify the ball map independently.

What is the pinout and package for LM3S9C97-IBZ80-A1?

The package is a 108-ball LFBGA with a 10x10 mm body. The supplier device package is 108-BGA (10x10). Pinout details are in the Texas Instruments datasheet for the LM3S9C97.