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Texas Instruments LM3S8970-IBZ50-A2 — Microcontrollers & Processors (MCU / MPU / DSP)

LM3S8970-IBZ50-A2 Stellaris ARM Cortex-M3 MCU, 50 MHz

MPNLM3S8970-IBZ50-A2
Obsolete

Texas Instruments Stellaris ARM Cortex-M3S 8000 series LM3S8970-IBZ50-A2, 32-bit ARM Cortex-M3 MCU, 50 MHz, 256 KB Flash, 64 KB RAM, Ethernet + CAN + I²C + SPI + UART, -40°C to 85°C, 108-LFBGA (10x10 mm), Tray.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LM3S8970-IBZ50-A2 specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 8000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.25V ~ 2.75V
Operating temperature-40°C~85°C(TA)
Speed50MHz
PackageTray
RAM size64K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityCANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART
Number of i (O)46
Core processorARM® Cortex®-M3
Case108-LFBGA
Program memory size256KB (256K x 8)

Product details

Production has ended; there is no current factory lead time or LTB window to enter. Sourcing now runs through independent distribution — we quote against an RFQ, confirm availability at quote time, and ship from verified surplus or new-old-stock inventory. For a BOM line that must stay on this footprint, the independent channel is the only option.

50 MHz Cortex-M3 with Ethernet and CAN — what it buys you

The ARM Cortex-M3 core runs at 50 MHz, a comfortable mid-range speed for industrial control, building automation, and gateway applications that need to run a lightweight TCP/IP stack and a CANopen node without breaking a sweat. That Ethernet+CAN combination is rare in the 50 MHz Cortex-M3 class — most peers offer one or the other, not both on-chip. The 46 GPIOs give enough headroom for a parallel LCD interface or a bank of opto-isolated inputs while keeping serial peripherals active. The internal oscillator reduces external BOM count, but for Ethernet timing accuracy an external crystal is still recommended.

108-BGA (10x10 mm) — layout notes

The 108-ball LFBGA on a 10x10 mm body with 0.8 mm pitch is a four-layer minimum footprint — two signal layers plus a solid ground plane and a power plane for the 2.5 V rail. The BGA's center balls carry VDD and VSS; a via-in-pad or at least a dogbone breakout is needed for the inner rows. No exposed thermal pad on this package; heat dissipation is through the solder balls and the PCB copper.

Frequently asked questions

Where can I buy the LM3S8970-IBZ50-A2?

Submit an RFQ — we quote against your quantity and confirm availability and current pricing at quote time. No stock figures or price can be published here; the supply posture is confirmed per inquiry.

Is the LM3S8970-IBZ50-A2 obsolete?

Yes, the LM3S8970-IBZ50-A2 carries an Obsolete product status. TI no longer manufactures it, and there is no active LTB window. All sourcing is from verified surplus or new-old-stock inventory through independent distributors.

What is the replacement for the LM3S8970-IBZ50-A2?

TI's Tiva-C or later Cortex-M4F series are functional successors but require a board redesign due to different package, supply voltage, and peripheral mapping. There is no pin-compatible drop-in replacement.

Does the LM3S8970 support Ethernet?

Yes, the LM3S8970 includes an integrated Ethernet MAC+PHY as part of its connectivity set.