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Texas Instruments LM3S8938-IBZ50-A2T — Microcontrollers & Processors (MCU / MPU / DSP)

LM3S8938-IBZ50-A2T Stellaris ARM Cortex-M3 MCU, 50MHz

MPNLM3S8938-IBZ50-A2T
Obsolete

Texas Instruments Stellaris® ARM® Cortex®-M3S 8000 series LM3S8938-IBZ50-A2T, 32-bit MCU, 50MHz, 256KB Flash, 64K x 8 RAM, 38 I/O, CAN/Ethernet, 108-LFBGA, -40 to 85°C.

$33.9700Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LM3S8938-IBZ50-A2T specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 8000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.25V ~ 2.75V
Operating temperature-40°C~85°C(TA)
Speed50MHz
PackageTape & Reel (TR)
RAM size64K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityCANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART
Number of i (O)38
Core processorARM® Cortex®-M3
Case108-LFBGA
Data convertersA/D 8x10b
Program memory size256KB (256K x 8)

Product details

50MHz Cortex-M3 with CAN and Ethernet — the industrial-control workhorse

It integrates a CANbus interface and a 10/100 Ethernet MAC, making it a single-chip fit for industrial gateways, motor drives, and building-automation controllers that need both fieldbus and IP connectivity. The 108-LFBGA (10x10 mm) package packs 38 GPIOs and an 8-channel 10-bit ADC into a compact footprint, with a supply range of 2.25V to 2.75V.

256KB Flash, 64KB SRAM — firmware and data buffer budget

The 256KB Flash supports a full TCP/IP stack, CANopen or EtherCAT slave code, plus application logic without external memory. The 64KB SRAM handles packet buffers and real-time data queues; for Ethernet-heavy designs, budget about 16KB for the stack and descriptor rings, leaving 48KB for application state. If your firmware exceeds 256KB, this part forces a code-shrink or a move to the larger-memory Stellaris siblings.

108-BGA — layout and rework considerations

The 108-LFBGA (10x10 mm) uses a 0.8 mm ball pitch, which is routable on a 4-layer board with 5/5 mil trace/space. No thermal pad — the BGA body dissipates through the balls to the PCB ground plane. For rework, MSL 3 handling applies: bake at 125°C for 24 hours if the moisture barrier bag has been open longer than the floor life. A 10x10 mm BGA is reballable with a stencil and preforms, but the fine pitch demands a good rework station.

Expect date codes from the last production runs; we screen for counterfeit and test to datasheet limits before shipment.

Frequently asked questions

Is LM3S8938-IBZ50-A2T obsolete?

Yes, TI lists the LM3S8938-IBZ50-A2T as Obsolete. There is no official replacement part designated.

What is a replacement for LM3S8938-IBZ50-A2T?

No official replacement has been published for the LM3S8938-IBZ50-A2T. For a pin-compatible alternative within the Stellaris family, check the LM3S8000 series — but verify the specific peripheral mix and package variant against your BOM. Without an official cross-reference, any substitution requires a full design review.

Can LM3S8938-IBZ50-A2T be programmed with ARM tools?

Yes. The core is an ARM Cortex-M3, so it works with standard ARM development tools: Keil MDK, IAR EWARM, and GCC-based toolchains (ARM GCC, Segger Embedded Studio). Debugging uses the Serial Wire Debug (SWD) interface via a standard JTAG/SWD probe like the J-Link or ST-Link.