48-LQFP package and board-fit
Housed in a 48-LQFP (7x7 mm) package, the LM3S801-IQN50-C2 uses a 0.50 mm pitch that demands a 4-layer board for full fan-out of the 36 I/O and supply pins.
Memory and peripheral headroom
64 KB of on-chip FLASH and 8 KB of SRAM leave room for a modest application stack after the HAL and RTOS overhead — the 8 KB RAM is the tighter budget for data buffers. Connectivity includes I²C, SPI, SSI, UART/USART, and Microwire — enough serial interfaces for a sensor hub or motor-control node without external bridge chips. On-chip peripherals include a PWM, watchdog timer, and brown-out detect/reset — the PWM can drive a small BLDC motor directly through a gate driver.
No second-source cross-reference exists — a board spin is required for any functional replacement.