LM3S800-EGZ50-C2 Stellaris ARM Cortex-M3S MCU 50MHz 64KB Flash
Stellaris LM3S800-EGZ50-C2, ARM Cortex-M3S core at 50MHz, 64KB FLASH / 8KB SRAM, 36 I/O, I²C/SPI/SSI/UART, 48-VFQFN 7×7mm exposed pad, -40°C to 105°C, 3.0–3.6V supply, tray.
Specifications
| Parameter | Value |
|---|---|
| Series | Stellaris® ARM® Cortex®-M3S 800 |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 3V ~ 3.6V |
| Operating temperature | -40°C~105°C(TA) |
| Speed | 50MHz |
| Package | Tray |
| RAM size | 8K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT |
| Connectivity | I²C, Microwire, SPI, SSI, UART/USART |
| Number of i (O) | 36 |
| Core processor | ARM® Cortex®-M3 |
| Case | 48-VFQFN Exposed Pad |
| Program memory size | 64KB (64K x 8) |
Frequently asked questions
Can I hot-swap the LM3S800-EGZ50-C2 in a socket for a line-down repair?
The brown-out detect/reset and POR peripherals are present on-chip, but hot-swapping a QFN device in a production socket introduces mechanical and thermal risk for the package and solder joint. Controlled power-down before removal is the safer practice for field-service replacement of a 48-VFQFN part. Confirm socket type and board layout against the original HMI gateway documentation before attempting in-circuit replacement.
What is the lead time and MOQ for a 25-unit panel-build run?
The EOL-hot lifecycle flag means lead time and minimum order quantity are quoted per RFQ — they are not fixed catalog parameters at this stage. Tray packaging is the standard pack form for this part; reel quantity and MOQ depend on current distributor allocation. Submit an RFQ with your 25-unit quantity and the EOL notification timeline from TI's Product Notification Center so sourcing can match available stock to your build schedule.