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Texas Instruments LM3S6G65-IQC80-A2T — Microcontrollers & Processors (MCU / MPU / DSP)

LM3S6G65-IQC80-A2T Stellaris ARM Cortex-M3 MCU, 80 MHz

MPNLM3S6G65-IQC80-A2T
End of Life

Texas Instruments Stellaris ARM Cortex-M3S 6000 series LM3S6G65-IQC80-A2T, 32-bit single-core MCU, 80 MHz, 512 KB Flash, 64 KB SRAM, 46 I/O, Ethernet + UART/I²C/SPI/SSI, 100-LQFP, -40 to 85°C.

Texas Instruments LM3S6G65-IQC80-A2T datasheet (PDF)
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

LM3S6G65-IQC80-A2T specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 6000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))3V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed80MHz
PackageTape & Reel (TR)
RAM size64K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityEthernet, I²C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Number of i (O)46
Core processorARM® Cortex®-M3
Case100-LQFP
Data convertersA/D 16x12b
Program memory size512KB (512K x 8)

Product details

The LM3S6G65-IQC80-A2T: This part is aimed at industrial control, building automation, networked sensors, and motor-drive applications where a single-chip MCU with Ethernet connectivity and a rich peripheral set is needed without an external network controller.

The 512 KB Flash (organized as 512K x 8) holds a substantial firmware image — enough for a TCP/IP stack, application logic, and a bootloader with room to spare. The 64 KB SRAM (64K x 8) supports moderate data buffers and runtime variables. For designs that need more headroom for Ethernet packet buffers or data logging, check whether the application fits within this memory envelope; if not, a sibling with larger SRAM in the same 100-LQFP footprint may be the better pick.

Ethernet on-chip — saves a separate MAC and external PHY interface

The integrated Ethernet MAC is the standout connectivity feature.

Package and footprint — 100-LQFP (14x14 mm)

No BGA routing complexity or via-in-pad requirements. The supplier device package is 100-LQFP (14x14), confirming the footprint. Surface-mount only.

Frequently asked questions

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