Skip to main content
Log in
Texas Instruments LM3S6C11-IBZ50-A1 — Microcontrollers & Processors (MCU / MPU / DSP)

LM3S6C11-IBZ50-A1 Texas Instruments Stellaris ARM Cortex-M3 MCU, 50MHz

MPNLM3S6C11-IBZ50-A1
End of Life

Texas Instruments Stellaris ARM Cortex-M3S 6000 series LM3S6C11-IBZ50-A1, 32-bit single-core MCU, 50 MHz, 512 KB Flash, 64 KB RAM, Ethernet and multiple serial interfaces, -40 to 85 °C, 108-BGA.

Texas Instruments LM3S6C11-IBZ50-A1 datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

LM3S6C11-IBZ50-A1 specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 6000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))3V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed50MHz
PackageTray
RAM size64K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityEthernet, I²C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART
Number of i (O)46
Core processorARM® Cortex®-M3
Case108-LFBGA
Program memory size512KB (512K x 8)

Product details

Stellaris M3 with Ethernet — what this chip delivers

The LM3S6C11-IBZ50-A1 is a 32-bit ARM Cortex-M3 microcontroller from the Stellaris 6000 series, clocked at 50 MHz. It packs 512 KB of Flash and 64 KB of RAM, with Ethernet MAC and multiple serial interfaces.

Lifecycle — active today, but watch for EOL notice

Texas Instruments has not published a formal discontinuation notice with a last-time-buy date at this time.

Temperature grade — industrial, not automotive

It is not AEC-Q100 qualified. Suitable for factory automation, outdoor telecom shelters, and commercial HVAC controllers. Not for under-hood automotive or downhole environments.

Frequently asked questions

Does LM3S6C11-IBZ50-A1 support Ethernet?

Yes, it integrates a 10/100 Mbps Ethernet MAC controller with MII/RMII interface. An external PHY chip is required. The Ethernet MAC is the primary reason to select this part over simpler Stellaris variants.

What is the exact package and footprint for LM3S6C11-IBZ50-A1?

The part comes in a 108-ball LFBGA package, supplier device package 108-BGA with a 10x10 mm body. The ball pitch is 0.8 mm. Surface-mount only, reflow assembly required.