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Texas Instruments LM3S6950-IQC50-A2 — Microcontrollers & Processors (MCU / MPU / DSP)

LM3S6950-IQC50-A2 — TI Stellaris ARM Cortex-M3 MCU, 50MHz, 256KB Flash, 100-LQFP

MPNLM3S6950-IQC50-A2
End of Life

Texas Instruments LM3S6950-IQC50-A2, Stellaris ARM Cortex-M3S 6000 series, 50MHz 32-bit single-core, 256KB Flash, 64KB RAM, 46 I/O, Ethernet/I²C/SPI/SSI/UART, internal oscillator, 2.25V–2.75V supply, -40°C–85°C operating temperature, 100-LQFP (14x14mm) package, tray.

$52.4800Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

LM3S6950-IQC50-A2 Technical Specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 6000
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.25V ~ 2.75V
Operating temperature-40°C~85°C(TA)
Speed50MHz
PackageTray
RAM size64K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityEthernet, I²C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Number of i (O)46
Core processorARM® Cortex®-M3
Case100-LQFP
Program memory size256KB (256K x 8)

Frequently asked questions

What temperature range does the -A2 variant support?

-40°C to 85°C ambient (TA). This matches the industrial temperature band expected for non-climate-controlled enclosure panels, but the 100-LQFP thermal characteristics must be verified against the enclosure thermal model for continuous operation at the upper limit.

Can I socket the 100-LQFP for field replacement?

The 100-LQFP at 0.5mm pitch is not practically field-socketed at this pin count. MRO stock replacements require either pre-socketed boards or a full rewire to a different package footprint.