Memory and peripheral budget for BOM fit
The LM3S615-IGZ50-C2: 32 KB of program Flash and 8 KB of SRAM.
Housed in a 48-VFQFN with an exposed thermal pad (7x7 mm body), the LM3S615-IGZ50-C2 requires a solid via-stitched ground plane under the pad to keep junction temperatures within limits at the 85°C end of the industrial range.
