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Texas Instruments LM3S6110-IBZ25-A2T — Microcontrollers & Processors (MCU / MPU / DSP)

LM3S6110-IBZ25-A2T Stellaris ARM Cortex-M3 MCU, 25 MHz

MPNLM3S6110-IBZ25-A2T
Obsolete

Texas Instruments Stellaris® ARM® Cortex®-M3S 6000 series LM3S6110-IBZ25-A2T, 32-bit ARM Cortex-M3 MCU, 25 MHz, 64 KB Flash, 16 KB RAM, Ethernet MAC+PHY, 35 I/O, 108-BGA (10x10 mm), -40°C to 85°C.

Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LM3S6110-IBZ25-A2T specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 6000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.25V ~ 2.75V
Operating temperature-40°C~85°C(TA)
Speed25MHz
PackageTape & Reel (TR)
RAM size16K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityEthernet, IrDA, Microwire, SPI, SSI, UART/USART
Number of i (O)35
Core processorARM® Cortex®-M3
Case108-LFBGA
Program memory size64KB (64K x 8)

Product details

What this Stellaris Cortex-M3 brings to the board

It packs 64 KB of program Flash and 16 KB of SRAM, with an integrated 10/100 Ethernet MAC+PHY — a rare find in a mid-density MCU of its generation. The peripheral set includes SPI, SSI, UART/USART, IrDA, and Microwire, plus a PWM unit and brown-out/POR supervisor.

At 25 MHz, this Cortex-M3 delivers roughly 25 DMIPS. That is enough for moderate control loops, TCP/IP stack processing on the internal Ethernet, and command/response protocols over UART or SPI. It is not a high-throughput DSP or a real-time motor-FOC controller — those would want a 100+ MHz sibling.

Memory sizing: 64 KB Flash, 16 KB RAM

The 64 KB program Flash and 16 KB SRAM set a firm ceiling on firmware complexity. A bare-metal TCP/IP stack plus a lightweight RTOS can fit, but a full FreeRTOS+LWIP build with a large application buffer will push against the 16 KB RAM limit. Plan the data buffer sizes and stack depth early in the design. The Flash is adequate for a bootloader, application code, and a small configuration page.

108-ball BGA — footprint and rework considerations

The part comes in a 108-ball LFBGA, 10x10 mm body. Rework demands a hot-air station with a BGA nozzle and a stencil for solder paste. The package is surface-mount only; no socket option exists. If your production line is not set up for BGA assembly, this part will add cost.

The Stellaris line was acquired by TI and later phased out; no direct pin-compatible replacement is offered from TI today. Sourcing is through the independent distribution channel — new-old-stock, surplus, or broker inventory.

Frequently asked questions

What is the replacement for LM3S6110-IBZ25-A2T?

There is no official pin-compatible replacement listed for the LM3S6110-IBZ25-A2T. The Stellaris ARM Cortex-M3 family has been discontinued by TI. Candidates from other vendors (e.g., NXP LPC17xx or STM32F107 series) exist but require a PCB redesign and firmware port. No direct drop-in is available.

What is the core of the LM3S6110?

The LM3S6110 uses a 32-bit ARM Cortex-M3 core, single-core, running at 25 MHz. It is part of the Stellaris ARM Cortex-M3S 6000 series.