Package and board-fit — 48-VFQFN exposed pad
The LM3S611-IGZ50-C2T ships in a 48-VFQFN exposed-pad package (7x7 mm body, supplier device package 48-VQFN). Mounting is surface-mount, tape-and-reel packaging (TR). The 0.50 mm pitch QFN demands a solder-paste stencil with aperture reduction on the thermal pad to avoid voiding — follow TI's application note for the recommended stencil thickness and reflow profile.
Core and memory — 50MHz Cortex-M3 with 32KB flash
The ARM Cortex-M3 core runs at 50 MHz, delivering 1.25 DMIPS/MHz for control-loop and protocol-stack tasks.
Peripherals and I/O — serial interfaces and ADC
Connectivity covers I²C, Microwire, SPI, SSI, and UART/USART — the SSI port can drive synchronous serial peripherals (ADCs, DACs, displays) while the UART handles debug or Modbus. The 4-channel 10-bit ADC (A/D 4x10b) samples at up to 500 ksps; the reference is the supply rail, so a clean 3.3 V supply is needed for accurate conversions. 32 general-purpose I/O pins are available, many with alternate functions for the serial peripherals and PWM. The brown-out detect and POR (power-on reset) circuits protect against supply glitches — the BOD threshold is set internally and triggers a reset when Vcc drops below approximately 2.7 V.