80 MHz Cortex-M3 with 64 KB Flash — what the BGA package means for board layout
The LM3S5P31-IBZ80-C3: The 108-BGA package (10x10 mm) routes all 67 I/O and the full peripheral set — CAN, USB, multiple serial interfaces — through a fine-pitch ball grid that demands a 4-layer PCB for fan-out.
Texas Instruments lists the LM3S5P31-IBZ80-C3 as Obsolete.
Peripheral set and memory headroom for control applications
The 80 MHz Cortex-M3 core delivers roughly 100 DMIPS — enough for real-time control loops with sensor fusion. The 64 KB Flash and 24K x 8 SRAM leave about 12 KB of RAM after a lightweight RTOS and stack, so data logging or USB buffers need careful budgeting. On-chip peripherals include a 16-channel 10-bit ADC, PWM, CAN, USB, and multiple serial interfaces (I²C, SPI, UART).
Temperature grade and environment
The internal oscillator eliminates an external crystal for basic timing, but USB operation still requires a precision external source.