What this Stellaris MCU brings to a control design
The LM3S5K31-IBZ80-C5: The 108-ball BGA package (10x10 mm) keeps the footprint compact, but the fine pitch demands careful PCB layout and controlled reflow profiles.
Peripheral set and memory — sizing the BOM fit
The 24 KB SRAM is modest by today's standards — firmware teams should budget tightly for stack and DMA buffers, especially when using the USB or CAN stacks.
Expect date codes to be non-current, and plan for incoming inspection to verify authenticity and condition.
Package and assembly notes for the 108-BGA
The 108-LFBGA (10x10 mm body) uses a 0.8 mm ball pitch — standard for BGA rework stations but tight for hand assembly. Supply voltage is 1.08 V to 1.32 V core, which means a dedicated 1.2 V rail is needed alongside the 3.3 V I/O supply. Plan for a separate LDO or switching regulator for the core rail.
