The LM3S5K31-IBZ80-C3: The part integrates a 16-channel 10-bit ADC, six PWM outputs, a quadrature encoder interface (QEI) for motor feedback, and a watchdog timer, all within a 108-ball BGA package measuring 10x10 mm.
Industrial temperature rating and BGA package — design-in constraints
The 108-LFBGA package (10x10 mm body, 0.8 mm ball pitch typical for this class) demands a controlled reflow profile per J-STD-020, X-ray inspection for voiding and solder-joint integrity, and a moisture sensitivity level (MSL) bake if the sealed bag has been opened beyond the floor-life window. The core supply is 1.08 V to 1.32 V — a dedicated 1.2 V rail is required, separate from the 3.3 V I/O supply. Decoupling should follow the layout guidelines in the Stellaris hardware development kit: one 0.1 µF ceramic per supply ball pair, plus a bulk 10 µF on the board.
No stock or lead-time number is published here because the supply position changes daily. If you hold an existing design with this MCU, securing a lifetime buy or identifying a pin-compatible migration path should be a priority.