The LM3S5C51-IBZ80-A2: The 108-BGA (10x10 mm) package brings out 67 general-purpose I/O. Connectivity is a strong suit: the MCU integrates CAN, USB OTG, I2C, SPI, SSI, UART, and LIN interfaces, plus a QEI for motor encoder feedback.
Texas Instruments has discontinued this Stellaris-series MCU, and no direct factory replacement is listed on the official record.
108-ball BGA — rework and layout considerations
The 67 I/O are distributed across the ball array, so fanout via microvias or blind vias is typical on a four-layer board. Under a hot-air station, this package is reworkable with practice — the 0.8 mm pitch leaves enough room for a stencil alignment window, and the 10x10 mm body has moderate thermal mass. Pre-bake at 125°C for 24 hours if the moisture barrier bag has been breached, as BGAs are MSL 3 or 3a and can pop during reflow. The orientation mark is a chamfered corner on the package; verify ball A1 location against the datasheet footprint drawing before placing.