This part carries an official lifecycle status of Obsolete. Date-code provenance matters here: stock that surfaces long after the EOL date should be verified for authenticity and moisture sensitivity (MSL) handling.
Package and footprint — 100-LQFP
Surface-mount only. The exposed paddle is not present on this package variant, so thermal management relies on the leadframe and airflow. For a rework technician: the 0.5 mm pitch calls for a fine-pitch soldering iron tip or a hot-air profile that avoids skewing adjacent leads. No BGA reball concerns here — this is a straightforward QFP rework.
