Any future procurement runs through independent distribution — verified stock, date-code rotation, and traceability handled per order.
108-ball BGA — layout and rework notes
Housed in a 108-ball LFBGA with a 10x10 mm body and 0.8 mm pitch. No exposed thermal pad — all heat dissipates through the BGA balls into the inner-layer copper pours. Supply range is 1.08 V to 1.32 V core, so a dedicated 1.2 V rail is needed — not a 3.3 V single-supply part. The 1.2 V rail must be clean and local to the BGA; a small LDO from the 3.3 V system rail works if the 80 MHz core current (around 50–80 mA typical) is within the LDO's rating.
On-chip data converters: 16-channel 10-bit ADC, enough for analog sensor acquisition in a motor-drive or power-monitoring role. Peripherals include PWM, QEI (for quadrature encoder inputs), I²S audio, and a watchdog timer.