Texas Instruments has discontinued this Stellaris-series MCU, and it is no longer available through authorized channels for new production. The part can be sourced through independent distribution on a last-time-buy or surplus basis.
108-ball BGA — footprint and rework notes
The 10x10 mm array with a 0.8 mm ball pitch is common for this density tier. For rework, standard BGA profiling applies: pre-bake at 125°C for 24 hours if the moisture barrier has been compromised (MSL 3 handling assumed). A via-in-pad design with microvias under the BGA is recommended for signal routing; the core voltage supply (1.08 V to 1.32 V) needs dedicated low-inductance decoupling close to the BGA pads.