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Texas Instruments LM3S5632-IQR50-A0 — Microcontrollers & Processors (MCU / MPU / DSP)

LM3S5632-IQR50-A0 Texas Instruments ARM Cortex-M3 MCU

MPNLM3S5632-IQR50-A0
NRND

Texas Instruments Stellaris ARM Cortex-M3S 5000 MCU, LM3S5632-IQR50-A0, 32-Bit Single-Core, 50MHz, 128KB Flash, 32K x 8 RAM, 64-LQFP.

$30.8019Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LM3S5632-IQR50-A0 specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 5000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.25V ~ 2.75V
Operating temperature-40°C~85°C(TA)
Speed50MHz
PackageTray
RAM size32K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityCANbus, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB
Number of i (O)33
Core processorARM® Cortex®-M3
Case64-LQFP
Data convertersA/D 6x10b
Program memory size128KB (128K x 8)

Product details

Cortex-M3 at 50 MHz — what the core brings to the board

The LM3S5632-IQR50-A0: On-chip memory: 128 KB of flash (128K x 8) and 32 KB of SRAM (32K x 8). The flash holds a moderate firmware stack; the SRAM leaves room for a RTOS heap and a few packet buffers. No external memory interface — the design lives within these limits.

Peripheral mix — CAN, USB, and serial in a 64-pin package

Connectivity includes CANbus, USB, I²C, SPI, SSI, UART/USART, IrDA, and Microwire — enough to talk to a motor drive over CAN, log data over USB, and poll sensors over SPI in one design. The 33 GPIOs share the 64-LQFP pins with these peripherals; check the pin mux before committing the schematic. A 6-channel 10-bit ADC is on-die, plus a PWM unit and a watchdog timer. The DMA engine moves data between peripherals and memory without CPU cycles — useful for streaming ADC readings into a buffer while the core handles the control loop.

Package and rework — 64-LQFP, 10x10 mm, exposed pad

That's a hand-solderable footprint under a microscope — the exposed thermal pad on the bottom needs a good solder joint to the board ground pour for heat sinking. The pin 1 chamfer is clear; orientation is unambiguous under a hot-air station.

Lifecycle reality — NRND, still orderable

For a repair or a production run on an existing board, the LM3S5632-IQR50-A0 remains orderable. New designs should look at the current Stellaris or TM4C family for a pin-compatible path.