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Texas Instruments LM3S2U93-IBZ80-A2 — Microcontrollers & Processors (MCU / MPU / DSP)

Texas Instruments LM3S2U93-IBZ80-A2 Cortex-M3 MCU, 80MHz

MPNLM3S2U93-IBZ80-A2
Obsolete

Texas Instruments Stellaris ARM Cortex-M3S 2000 series MCU, LM3S2U93-IBZ80-A2, 32-bit single-core, 80MHz, 384KB flash, 96KB RAM, 108-LFBGA, tray.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LM3S2U93-IBZ80-A2 specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 2000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.235V ~ 1.365V
Operating temperature-40°C~85°C(TA)
Speed80MHz
PackageTray
RAM size96K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, I²C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Number of i (O)67
Core processorARM® Cortex®-M3
Case108-LFBGA
Data convertersA/D 16x10b
Program memory size384KB (384K x 8)

Product details

Core architecture and memory map

The LM3S2U93-IBZ80-A2: Built around the ARM Cortex-M3 core at 80 MHz, this 32-bit single-core MCU delivers the deterministic interrupt handling and Thumb-2 instruction set typical of the M3 family. On-chip program memory is 384 KB of flash, paired with 96 KB of SRAM — the 96K x 8 entry maps to 96 KB of byte-addressable RAM. For a Cortex-M3 class device, the 1:4 flash-to-RAM ratio is generous, suiting applications that keep a moderate-sized frame buffer or communication stack in SRAM.

The peripheral list includes CANbus, EBI/EMI, I²C, IrDA, Microwire, QEI, SPI, SSI, and UART/USART — a broad mix that covers industrial fieldbus (CAN), external memory expansion (EBI/EMI), and sensor interfaces (SPI, I²C). The 16-channel 10-bit ADC provides analog acquisition without an external converter. On-chip peripherals also include brown-out detect/reset, DMA, I²S, POR, PWM, and WDT. The 67 I/O lines give enough headroom for a parallel display or memory bus alongside GPIO.

Package, power, and temperature grade

Housed in a 108-LFBGA package with a supplier device package designation of 108-BGA (10x10). The 10x10 mm body with a 0.80 mm ball pitch is a standard footprint for this density — four-layer board with via-in-pad is typical for fan-out.