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Texas Instruments LM3S1R21-IBZ80-C3T — Microcontrollers & Processors (MCU / MPU / DSP)

Texas Instruments LM3S1R21-IBZ80-C3T ARM Cortex-M3 MCU

MPNLM3S1R21-IBZ80-C3T
Obsolete

Texas Instruments Stellaris ARM Cortex-M3S 1000 series, LM3S1R21-IBZ80-C3T, 32-bit single-core MCU, 80MHz, 256KB Flash, 48KB RAM, 67 I/O, 108-LFBGA, -40°C to 85°C, Tape & Reel.

Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LM3S1R21-IBZ80-C3T specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 1000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.08V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed80MHz
PackageTape & Reel (TR)
RAM size48K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityEBI/EMI, I²C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART
Number of i (O)67
Core processorARM® Cortex®-M3
Case108-LFBGA
Data convertersA/D 8x10b
Program memory size256KB (256K x 8)

Product details

80 MHz Cortex-M3 with 256 KB Flash — what the memory ratio means for firmware fit

The LM3S1R21-IBZ80-C3T runs an ARM Cortex-M3 core at 80 MHz, with 256 KB of Flash and 48 KB of SRAM on-chip. That 5.3:1 Flash-to-RAM ratio is typical for a control-oriented MCU — the firmware image, including a real-time operating system kernel and communication stacks (TCP/IP, USB, CAN), fits in the Flash, while the SRAM handles the stack and data buffers without external memory.

Texas Instruments has marked the LM3S1R21-IBZ80-C3T as Obsolete. For a BOM line that already carries this order code, the sourcing posture is quoted-to-order against the required volume.

With 67 general-purpose I/O and a peripheral set that includes EBI/EMI, I²C, SPI, SSI, UART/USART, IrDA, LINbus, and Microwire, this MCU can interface directly with parallel LCDs, serial sensors, motor encoder interfaces, and LIN-based automotive subnets without a port expander or protocol translator. The 8-channel 10-bit ADC samples analog inputs for current sensing or temperature monitoring on the same die.

Package — 108-ball BGA layout constraints

Supplied in a 108-LFBGA with a 10x10 mm body and 0.80 mm ball pitch. The tight pitch demands at least a 4-layer PCB for fan-out of the inner balls to via-in-pad or dog-bone traces.

Frequently asked questions

What is the maximum clock speed and memory configuration of LM3S1R21-IBZ80-C3T?

The Cortex-M3 core runs at 80 MHz. On-chip memory is 256 KB of Flash and 48 KB of SRAM.

What interface protocols does this MCU support?

The connectivity block includes EBI/EMI, I²C, IrDA, LINbus, Microwire, SPI, SSI, and UART/USART — enough to handle parallel displays, serial sensors, LIN automotive networks, and legacy Microwire peripherals without external protocol conversion.