The LM3S1N16-IQR50-C5T: The 64-LQFP package (10x10 mm body) is a common footprint for mid-density MCUs; the 0.5 mm pitch demands careful solder-paste stencil design but is well within standard assembly capability.
Texas Instruments has designated the LM3S1N16-IQR50-C5T as obsolete. For BOM lines that still call out this exact code, procurement must rely on the independent surplus and broker channel.
