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Texas Instruments LM3S1N11-IBZ50-C1 — Microcontrollers & Processors (MCU / MPU / DSP)

LM3S1N11-IBZ50-C1 Texas Instruments Cortex-M3 MCU, 50 MHz

MPNLM3S1N11-IBZ50-C1
Obsolete

Texas Instruments Stellaris ARM Cortex-M3S 1000 microcontroller, LM3S1N11-IBZ50-C1, 50 MHz, 64 KB flash, 12 KB SRAM, 108-BGA, industrial temp.

Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LM3S1N11-IBZ50-C1 specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 1000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.08V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed50MHz
PackageTray
RAM size12K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART
Number of i (O)67
Core processorARM® Cortex®-M3
Case108-LFBGA
Data convertersA/D 8x10b
Program memory size64KB (64K x 8)

Product details

Texas Instruments lists the LM3S1N11-IBZ50-C1 as obsolete. This part is sourced through independent distribution channels — quantities are lot-specific and confirmed at RFQ. Availability and current pricing are quoted to order.

Cortex-M3 core at 50 MHz — firmware headroom

The ARM Cortex-M3 core runs at 50 MHz — this is the deterministic interrupt-handling workhorse for control-loop and protocol-stack tasks. The 64 KB on-chip flash and 12 KB SRAM are the firmware budget; the bootloader and HAL consume part of the flash before the application starts. Step through the boot ROM on first power-up to confirm the flash layout matches the linker script. The 32-bit single-core architecture with a single-cycle multiply and hardware divide handles 8/16/32-bit data efficiently for motor-control and sensor-fusion loops. Internal oscillator saves an external crystal on the BOM when the timing tolerance is acceptable for UART and I²C baud rates.

67 general-purpose I/O lines are multiplexed with the serial interfaces: I²C, IrDA, LINbus, Microwire, SPI, SSI, and UART/USART. The 8-channel 10-bit ADC samples analog inputs — the conversion clock and sample time must be configured per the datasheet timing to avoid aliasing on fast edges. On-chip peripherals include brown-out detect/reset, DMA, POR, PWM, and a watchdog timer. The DMA engine offloads peripheral-to-memory transfers without CPU intervention — useful for buffered serial streams or ADC scan sequences. The PWM module drives H-bridge or three-phase inverter stages directly.

108-BGA package — board integration

The 108-ball LFBGA with a 10x10 mm body requires a 4-layer PCB minimum for fan-out of the inner balls. The 0.80 mm ball pitch is standard for this density — the via-in-pad or microvia approach keeps the breakout clean. Surface-mount assembly with a standard reflow profile.

Frequently asked questions

What is the LM3S1N11-IBZ50-C1's core speed and memory?

The ARM Cortex-M3 core runs at 50 MHz. On-chip memory is 64 KB of flash and 12 KB of SRAM. The flash is 64 KB organized as 64K x 8 bits; the SRAM is 12 KB as 12K x 8 bits.

What package does the LM3S1N11-IBZ50-C1 use?

It ships in a 108-ball LFBGA with a 10x10 mm body. The supplier device package is 108-BGA (10x10). Surface-mount assembly with a standard reflow profile.