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Texas Instruments LM3S1F11-IBZ80-A2T — Microcontrollers & Processors (MCU / MPU / DSP)

LM3S1F11-IBZ80-A2T Texas Instruments Stellaris MCU, 80MHz

MPNLM3S1F11-IBZ80-A2T
Obsolete

Texas Instruments Stellaris® ARM® Cortex®-M3S 1000 series microcontroller, LM3S1F11-IBZ80-A2T, 32-bit single-core, 80MHz, 384KB FLASH, 48K x 8 RAM, 67 I/O, 108-LFBGA.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LM3S1F11-IBZ80-A2T specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 1000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.235V ~ 1.365V
Operating temperature-40°C~85°C(TA)
Speed80MHz
PackageTape & Reel (TR)
RAM size48K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityEBI/EMI, I²C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART
Number of i (O)67
Core processorARM® Cortex®-M3
Case108-LFBGA
Data convertersA/D 8x12b
Program memory size384KB (384K x 8)

Product details

Obsolete — the sourcing reality for this Stellaris MCU

The LM3S1F11-IBZ80-A2T: For a BOM line that already carries this part, the supply path runs through independent distribution. Stock is confirmed at RFQ; quantities are lot-specific and date-code traceable.

80 MHz Cortex-M3 — what the core delivers

The ARM Cortex-M3 core runs at 80 MHz — a 32-bit single-core pipeline with hardware divide and single-cycle multiply. This sets the throughput ceiling for the application; the actual instruction execution rate depends on flash wait states and bus contention from the DMA controller. On-chip memory comprises 384 KB of flash for program storage and 48 KB of SRAM for data. The flash is large enough for a full protocol stack plus application logic; the SRAM budget of 48 KB constrains the runtime heap and stack depth, particularly with multiple active communication buffers.

Peripheral set and analog acquisition

The part integrates 67 general-purpose I/O lines, a suite of serial interfaces including I²C, SPI, SSI, UART/USART, IrDA, LIN, and Microwire, plus an external bus interface (EBI/EMI) for memory-mapped peripherals. The 8-channel 12-bit ADC provides analog input for multi-sensor acquisition without an external converter. On-chip peripherals include brown-out detection, power-on reset, a PWM module, a watchdog timer, and a DMA controller — enough to offload data movement from the core without an external CPLD or FPGA.

Package, supply, and temperature grade

Housed in a 108-ball LFBGA (10x10 mm body), the 0.80 mm pitch BGA demands a multi-layer PCB for fan-out — a two-layer board will not break out the inner balls. The supplier device package is 108-BGA (10x10).