Texas Instruments has marked the LM3S1F11-IBZ50-A1 as Obsolete. Sourcing is through independent distribution — quantities are lot-specific and confirmed at RFQ.
Core and memory — what the 50 MHz and 384 KB mean for fit
The ARM Cortex-M3 core runs at 50 MHz, delivering the deterministic interrupt response and Thumb-2 instruction set density typical of this architecture. On-chip memory comprises 384 KB of flash and 48 KB of SRAM — the flash is sized for a moderate application stack including a real-time kernel and communication protocol layers, while the 48 KB RAM supports data buffers and stack without external memory in many designs.
67 I/O lines are available in the 108-ball BGA package. The connectivity block includes EBI/EMI for external memory or parallel peripherals, plus I²C, SPI, SSI, UART/USART, IrDA, LINbus, and Microwire — covering most industrial and embedded bus standards without external transceivers for the logic-level interfaces. An 8-channel 12-bit ADC provides analog measurement capability on-chip. The brown-out detect, POR, watchdog timer, and PWM are integrated peripherals that reduce external component count for motor-control or safety-monitoring applications.
Package and board integration — 108-ball BGA
The 108-LFBGA package with a 10x10 mm body requires a multi-layer PCB for fan-out of the 0.65 mm or finer ball pitch typical of this footprint. Surface-mount assembly with a solder reflow profile matched to the BGA's moisture sensitivity level is expected.