80 MHz Cortex-M3 in a compact BGA
The LM3S1C58-IBZ80-A1T: The device is housed in a 108-LFBGA (10x10 mm) package for surface-mount assembly, supplied in Tape & Reel.
The 16-channel 12-bit ADC covers analog sensing, while the DMA engine offloads data transfers without CPU intervention.
Buyers should evaluate the BOM for an alternative if a long-term supply is needed — no pin-compatible direct replacement from TI has been published for this exact code.
BGA footprint and layout notes
The 108-LFBGA (10x10 mm) package requires a multi-layer PCB with via-in-pad or microvias for fanout. The core supply is 1.235 V to 1.365 V — a separate LDO or DC-DC rail is needed.
