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Texas Instruments LM3S1608-IBZ50-A2T — Microcontrollers & Processors (MCU / MPU / DSP)

LM3S1608-IBZ50-A2T TI ARM Cortex-M3 MCU, 50 MHz, 128KB Flash

MPNLM3S1608-IBZ50-A2T
NRND

Texas Instruments Stellaris® ARM® Cortex®-M3S 1000 series MCU, LM3S1608-IBZ50-A2T, 50 MHz, 128KB Flash, 32KB RAM, 108-BGA, -40°C to 85°C.

$22.6372Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LM3S1608-IBZ50-A2T specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 1000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.25V ~ 2.75V
Operating temperature-40°C~85°C(TA)
Speed50MHz
PackageTape & Reel (TR)
RAM size32K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI²C, IrDA, Microwire, SPI, SSI, UART/USART
Number of i (O)52
Core processorARM® Cortex®-M3
Case108-LFBGA
Data convertersA/D 8x10b
Program memory size128KB (128K x 8)

Product details

What the NRND status means for your BOM line

Texas Instruments lists the LM3S1608-IBZ50-A2T as NRND (Not Recommended for New Designs). This means the part is still available for existing production but is not intended for new design-ins — the manufacturer will not support new project starts with this order code. For a BOM that already carries this MCU, the NRND flag signals a finite procurement window. Stock is available through independent distribution; quantities and lead times are confirmed at RFQ.

50 MHz Cortex-M3 with 128 KB flash — throughput and memory headroom

The ARM Cortex-M3 core runs at 50 MHz — this is the instruction throughput ceiling for the application. The 128 KB on-chip flash (128K x 8) and 32 KB SRAM (32K x 8) provide enough code and data space for mid-complexity control firmware, sensor fusion, or protocol-stack execution without external memory. Flash program memory type means field firmware updates are possible over the UART or SPI bootloader, but the 100K erase/write cycle endurance per sector should be budgeted into the update strategy.

108-ball BGA — board integration and supply rails

Housed in a 108-LFBGA package with a 10x10 mm body (supplier device package 108-BGA 10x10), the part requires a multi-layer PCB for fan-out of the 0.50 mm pitch balls. The 52 available I/O route to peripherals and external interfaces.

Peripheral set — connectivity and analog interface

Connectivity options include I²C, IrDA, Microwire, SPI, SSI, and UART/USART — enough serial interfaces to handle sensor buses, display modules, and debug links without an external UART bridge. On-chip peripherals include brown-out detect/reset, POR, PWM, and a watchdog timer — these supervisory blocks reduce external component count for power sequencing and fault recovery. An 8-channel 10-bit ADC handles analog inputs like potentiometers, current shunts, or temperature sensors directly.

Frequently asked questions

How can I order the LM3S1608-IBZ50-A2T or check availability?

The LM3S1608-IBZ50-A2T is NRND but available to order through independent distribution. No stock-holding claim is made here; sourcing is per request.

What is the closest pin-compatible alternative to the LM3S1608-IBZ50-A2T?

Within the Stellaris ARM Cortex-M3S 1000 series, other flash/RAM variants share the same core and package footprint, but pin compatibility must be verified against the respective datasheets — no cross-reference is confirmed here.

What compliance documentation does Texas Instruments provide for the LM3S1608-IBZ50-A2T?

The part is RoHS-compliant as supplied on tape and reel. TI provides a datasheet, PCN notifications, and material declaration.