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Texas Instruments LM3S1608-IBZ50-A2 — Microcontrollers & Processors (MCU / MPU / DSP)

Texas Instruments LM3S1608-IBZ50-A2 MCU, Cortex-M3, 50 MHz

MPNLM3S1608-IBZ50-A2
NRND

Texas Instruments Stellaris ARM Cortex-M3S 1000 series 32-bit MCU, LM3S1608-IBZ50-A2, 50 MHz, 128 KB flash, 32 KB SRAM, 108-BGA, industrial temp.

$26.4680Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LM3S1608-IBZ50-A2 specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 1000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.25V ~ 2.75V
Operating temperature-40°C~85°C(TA)
Speed50MHz
PackageTray
RAM size32K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI²C, IrDA, Microwire, SPI, SSI, UART/USART
Number of i (O)52
Core processorARM® Cortex®-M3
Case108-LFBGA
Data convertersA/D 8x10b
Program memory size128KB (128K x 8)

Product details

Cortex-M3 core at 50 MHz — what the speed buys you

The LM3S1608-IBZ50-A2 runs an ARM Cortex-M3 core at 50 MHz — this is the processing ceiling for the interrupt-driven control loops typical in motor-drive or sensor-fusion firmware. The 32-bit single-core architecture delivers deterministic context switching; the NVIC handles up to 32 interrupt vectors with a fixed 12-cycle entry latency, so the core can service a fast sensor edge without polling overhead. On-chip memory is 128 KB of flash for program store and 32 KB of SRAM for data. That flash footprint accommodates a moderate HAL plus a real-time operating system kernel and leaves room for application logic; the 32 KB SRAM supports a few kilobytes of stack and heap per task before hitting the ceiling. A firmware developer targeting this part should budget the SRAM for the interrupt stack and DMA buffers first.

Connectivity spans I²C, SPI, SSI, UART/USART, and IrDA — enough to talk to external ADCs, serial flash, or a fieldbus transceiver without an external UART bridge. The 52 GPIOs are general-purpose but share pads with the serial peripherals; a layout that routes out all four UARTs and two SPI buses consumes roughly half the available pins, leaving two dozen for discrete I/O. The on-chip ADC is 8-channel, 10-bit — adequate for reading potentiometers, current-sense resistors, or temperature sensors at moderate update rates.

Package, supply, and temperature grade

Housed in a 108-ball BGA (10x10 mm body), the part requires a multi-layer PCB for fan-out — the 0.80 mm ball pitch does not route on a two-layer board without blind vias. The internal oscillator starts up without an external crystal, though a crystal on the main oscillator input improves accuracy for time-sensitive serial protocols.

Frequently asked questions

What package does LM3S1608-IBZ50-A2 use?

It is supplied in a 108-ball LFBGA with a 10x10 mm body (supplier device package 108-BGA). The ball pitch is 0.80 mm, requiring a multi-layer PCB for fan-out.