The LM3S1162-IQC50-A2: For a BOM line that depends on this part, the available supply is limited to existing inventory held by independent distributors and surplus channels.
Core and memory — 50 MHz Cortex-M3 with 64 KB Flash
This core delivers the DSP extensions and single-cycle multiply that make it suitable for control-loop and sensor-fusion tasks where a simple 8-bit MCU would run out of headroom. On-chip program memory is 64 KB of Flash, backed by 16 KB of SRAM. The Flash-to-RAM ratio supports modest firmware images with enough working memory for moderate data buffering or protocol stacks.
Package and board-fit — 100-LQFP, 14x14 mm
Housed in a 100-LQFP package with a 14x14 mm body, the part uses a 0.5 mm pitch that requires a 4-layer PCB for reliable fan-out of all signals. The exposed pad on the underside provides a low-thermal-resistance path to the board — a thermal via array under the pad is recommended for continuous operation at the full 85°C ambient.
I/O and connectivity — 46 GPIOs, serial interfaces, 2x10-bit ADC
With 46 general-purpose I/O pins and a peripheral set that includes I²C, SPI, SSI, UART/USART, and IrDA, the part can interface to common sensors, displays, and serial memories without external bridge chips. The two 10-bit ADC channels handle basic analog inputs like potentiometer feedback or battery voltage monitoring. On-chip peripherals include brown-out detect, power-on reset, PWM outputs, and a watchdog timer — enough to build a standalone controller without external supervisor ICs for most applications.