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Texas Instruments LM3S1162-IBZ50-A2T — Microcontrollers & Processors (MCU / MPU / DSP)

TI LM3S1162-IBZ50-A2T ARM Cortex-M3 MCU, 50MHz, 64KB Flash

MPNLM3S1162-IBZ50-A2T
NRND

Texas Instruments Stellaris LM3S1162-IBZ50-A2T, 32-bit ARM Cortex-M3 at 50MHz, 64KB Flash/16KB RAM, 46 I/O, 108-LFBGA, 2.25–2.75V supply, -40°C to 85°C, Tape & Reel.

$16.0508Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LM3S1162-IBZ50-A2T specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 1000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.25V ~ 2.75V
Operating temperature-40°C~85°C(TA)
Speed50MHz
PackageTape & Reel (TR)
RAM size16K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI²C, IrDA, Microwire, SPI, SSI, UART/USART
Number of i (O)46
Core processorARM® Cortex®-M3
Case108-LFBGA
Data convertersA/D 2x10b
Program memory size64KB (64K x 8)

Product details

50 MHz Cortex-M3 and the peripheral set that matters

The LM3S1162-IBZ50-A2T: The ARM Cortex-M3 core at 50 MHz handles single-cycle multiply and hardware divide, which keeps interrupt latency low for real-time tasks like PWM update or sensor polling. Two 10-bit ADC channels are integrated, enough for one or two analog feedback signals without an external converter. The internal oscillator means you can boot without a crystal, though a precision clock improves timing for baud-rate generation. The 46 I/O lines in a 108-LFBGA package mean many pins are shared with alternate functions — the BGA ball map needs careful routing to avoid signal conflicts on shared pads.

NRND status — plan the replacement now

TI lists the product status as NRND. No last-time-buy date is published in the record.

BGA assembly and rework notes

The 108-BGA (10x10 mm) package has a 0.8 mm ball pitch typical for this density. That is hand-solderable with a hot-air station and stencil, but the inner balls are hard to inspect without X-ray. The board needs a via-in-pad or microvia strategy for the center balls to escape to inner layers.

Frequently asked questions

Is LM3S1162-IBZ50-A2T obsolete? What is the recommended replacement?

No official successor order code appears in the record. For new designs, evaluate current TI Stellaris or Tiva-C series MCUs with similar ARM Cortex-M3 cores, 2.5 V supply, and 108-BGA footprint. For legacy BOMs, source remaining stock through independent distribution against an RFQ.