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Texas Instruments LM3S1150-IBZ50-A2 — Microcontrollers & Processors (MCU / MPU / DSP)

LM3S1150-IBZ50-A2 Stellaris ARM Cortex-M3 MCU, 50 MHz, NRND

MPNLM3S1150-IBZ50-A2
NRND

Texas Instruments Stellaris ARM Cortex-M3S 1000 series LM3S1150-IBZ50-A2, 32-bit ARM Cortex-M3 MCU, 50 MHz, 64 KB Flash, 16 KB RAM, 52 I/O, 108-BGA, -40 to 85°C, 2.25 V to 2.75 V supply.

$23.8962Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LM3S1150-IBZ50-A2 specifications
ParameterValue
SeriesStellaris® ARM® Cortex®-M3S 1000
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.25V ~ 2.75V
Operating temperature-40°C~85°C(TA)
Speed50MHz
PackageTray
RAM size16K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI²C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Number of i (O)52
Core processorARM® Cortex®-M3
Case108-LFBGA
Program memory size64KB (64K x 8)

Product details

For sustainment programs already using this MCU, the immediate task is to secure lifetime buy quantities or qualify a form-fit-function replacement before the EOL notice arrives.

50 MHz Cortex-M3 — processing headroom for control and sensor fusion

The ARM Cortex-M3 core runs at 50 MHz, placing this MCU in the mid-range tier for 32-bit microcontrollers. The 16 KB SRAM (organized as 16K x 8) is tight for heavy protocol stacks; expect to budget carefully if running a TCP/IP stack or USB host class driver alongside application code. The 64 KB Flash (64K x 8) stores firmware plus a modest bootloader for field updates.

Connectivity covers I²C, IrDA, Microwire, QEI (quadrature encoder interface for motor position), SPI, SSI, and two UART/USART channels. The 52 general-purpose I/O pins, mapped to the 108-ball BGA, give enough GPIO for parallel LCD data buses or multiple chip selects without an external port expander.

Package and layout — 108-BGA (10x10 mm)

The 108-ball BGA measures 10x10 mm with a 0.8 mm ball pitch. That pitch is forgiving enough for a four-layer PCB with blind vias, but the BGA footprint still requires solder-paste stencil design and X-ray inspection after reflow.

Frequently asked questions

What is the replacement for LM3S1150-IBZ50-A2?

No official pin-compatible drop-in replacement is listed in the TI cross-reference. The Stellaris family has been superseded by TI's Tiva C Series (TM4C123x) and Hercules safety MCUs, but those are not pin-compatible. For a form-fit-function replacement, evaluate the TM4C123GH6PM in a similar BGA package — it offers a Cortex-M4F at 80 MHz with more Flash and RAM, but requires a PCB layout change and firmware migration.