Core specs and memory budget for a firmware image
The LM3S1133-EQC50-A2T runs an ARM Cortex-M3 core at 50 MHz — the DMIPS ceiling is set by the flash wait-state profile at this clock, not the core itself. On-chip memory is 64 KB flash (64K x 8) and 16 KB SRAM (16K x 8), which together define the firmware image size and runtime heap/stack budget. Operating temperature spans -40°C to 105°C, the industrial-grade range that covers engine-bay and outdoor enclosure deployments without active cooling. Supply voltage is 2.25 V to 2.75 V on a single rail — no separate I/O supply, so the core and GPIO levels track together.
Connectivity includes I²C, SPI, SSI, UART/USART, IrDA, and Microwire — enough serial bus options to interface with external sensors, memory, and display modules without an external bridge chip. 44 GPIOs are available on the 100-LQFP package, which is sufficient for moderate parallel I/O or matrix-keypad scanning without an external port expander. On-chip peripherals include brown-out detect/reset, POR, PWM, and a watchdog timer — these reduce the external supervisor IC count for a minimal BOM. Two 10-bit ADC channels provide basic analog-to-digital conversion for voltage or current sensing; the 10-bit resolution is adequate for monitoring thresholds but not high-precision measurement.
No stock-holding claim is made here — sourced per request against the BOM line.
Package and board-fit for the 100-LQFP
The 100-LQFP package has a 14x14 mm body with 0.5 mm pitch — a 4-layer board is recommended for fan-out of the inner rows. The supplier device package is 100-LQFP (14x14). Surface-mount mounting type; the part ships in Tape & Reel (TR) format for automated pick-and-place assembly.