DSBGA package — what it changes for assembly and rework
The LM358TPX/NOPB is the 8-ball DSBGA (8-UFBGA, DSBGA) variant of the classic LM358 dual general-purpose op-amp. Instead of the familiar SOIC-8 or DIP-8, this part comes in a 0.50 mm pitch wafer-level chip-scale package — roughly the same footprint as the silicon itself. That means the PCB land pattern is a 4×2 array of 0.25 mm solder balls, and the part is intended for direct solder reflow with no underfill in most cases. The DSBGA package saves board area but demands tighter stencil aperture control and a reflow profile tuned for lead-free SAC305. Rework is possible with a hot-air nozzle sized to the 2.0 mm × 1.5 mm body, but the risk of adjacent ball bridging is higher than with a molded QFN.
Supply range and temperature — fit for commercial gear
Gain bandwidth is 1 MHz, input offset voltage 2 mV typical, input bias current 45 nA. These are the classic LM358 numbers: adequate for DC-coupled sensor buffers, active filters below 100 kHz, and comparator duties with pull-up.
The base product number is LM358, which covers a broad family of package and temperature variants. The TPX suffix specifically denotes the DSBGA package with Tape & Reel delivery. The /NOPB suffix confirms lead-free (RoHS-compliant) construction.